Job Description: Silicon Chip Lead (First Pass Silicon Expertise)

Position Title: Silicon Chip Lead

Location: Bengaluru

Company Overview:

AISemiCon is at the forefront of semiconductor innovation, delivering cutting-edge solutions that power a wide range of industries, including [e.g., consumer electronics, automotive, AI, etc.]. We are seeking an experienced and results-driven Silicon Chip Lead with a proven track record of delivering multiple first-pass silicon successes. In this leadership role, you will drive the architecture, design, and successful deployment of high-performance, reliable silicon chips that exceed customer expectations.

Position Overview:

The Silicon Chip Lead will spearhead the end-to-end design and development of advanced semiconductor chips, focusing on achieving first-pass silicon success. This role requires a unique blend of technical expertise, leadership, and strategic oversight, combining deep knowledge of silicon design, verification, and post-silicon validation. The ideal candidate will have extensive experience leading chip development efforts and optimizing design processes to ensure high-quality first-pass results.

As the Silicon Chip Lead, you will collaborate with cross-functional teams, including hardware, software, and system engineers, to deliver complex chips that meet stringent performance, power, and reliability goals. You will also mentor and guide junior engineers, creating a culture of excellence in design and execution.

Key Responsibilities:

1. Chip Architecture & Design Leadership:

• Lead the architecture and design of advanced silicon chips (e.g., ASICs, SoCs, or custom IPs) from concept to tape-out, ensuring alignment with product requirements and timelines.
• Drive design decisions and trade-offs across power, performance, area (PPA), and manufacturability.
• Define and implement innovative solutions for challenging technical problems to ensure the highest quality and performance in first-pass silicon.

2. First Pass Silicon Success:

• Leverage your experience in achieving first-pass silicon success to lead and drive the design to successful tape-out and manufacturing.
• Identify and mitigate risks early in the design process to prevent common issues that might lead to silicon bring-up failures.
• Collaborate closely with silicon validation and post-silicon teams to ensure early success in real-world testing, addressing any design issues proactively.

3. Cross-functional Collaboration:

• Collaborate with hardware, software, verification, and system teams to ensure seamless integration of silicon components into larger system architectures.
• Partner with the product and business teams to ensure the chip meets key customer and market requirements, translating those requirements into actionable design objectives.

4. Mentorship and Team Leadership:

• Lead, mentor, and develop a team of talented engineers, ensuring a high level of technical competence and fostering innovation.
• Provide guidance and direction on best practices in chip design, verification, and debug processes.
• Foster a culture of accountability, continuous improvement, and quality within the engineering team.

5. Verification and Post-Silicon Validation:

• Own the overall chip verification strategy, ensuring the development and execution of comprehensive test plans and methodologies.
• Lead the analysis of first-pass silicon test results and work with cross-functional teams to root-cause any issues, ensuring timely resolutions.
• Oversee the post-silicon validation process, driving the closure of bugs and improvements.

6. Optimization and Performance Tuning:

• Optimize designs for power, performance, and area (PPA), ensuring chips meet stringent market and customer requirements.
• Lead the use of design optimization tools and techniques to achieve high-performance silicon, balancing trade-offs to achieve the optimal solution.

7. Process Improvement:

• Identify and implement improvements in the chip development lifecycle to increase efficiency, reduce risk, and improve first-pass success rates.
• Stay up-to-date with the latest semiconductor process technologies, design tools, and best practices to ensure the team remains at the cutting edge.

Required Qualifications:

Education:

• Bachelor’s or Master’s degree in Electronics/Electrical/Computer Engineering, or a related field. A Ph.D. is a plus.

Experience:

• 20+ years of hands-on experience in silicon chip design, with 5+ years in a leadership role, ideally in a fast-paced, production-oriented environment.
• Proven experience delivering multiple first-pass silicon successes across complex ASIC, SoC, or custom IP designs.
• Expertise in designing high-performance chips for applications such as [e.g., AI, networking, consumer electronics, automotive, etc.].
• Strong background in digital design (HDL, Verilog/VHDL), RTL design, and experience with key tools such as Cadence, Synopsys, or Mentor Graphics.
• Expertise in design for manufacturability (DFM), design for testability (DFT), and performance optimization techniques.
• Demonstrated ability to drive first-pass success in silicon by addressing design issues early and applying advanced validation techniques.

Technical Skills:

• In-depth understanding of silicon design processes, including RTL design, physical design, timing closure, and layout verification.
• Experience in complex system-on-chip (SoC) architectures, including embedded processors, memory subsystems, and high-speed interfaces.
• Familiarity with simulation, emulation, and debugging tools, and hands-on experience with post-silicon validation processes.
• Strong knowledge of verification methodologies, including functional, performance, and power verification.
• Experience in leading cross-functional teams to identify and resolve post-silicon issues effectively.
• Deep understanding of process nodes (e.g., 7nm, 5nm, 3nm) and the impact of advanced technology nodes on design, verification, and manufacturing.

Preferred Qualifications:

• Experience in AI, machine learning, or high-performance computing chip designs.
• Familiarity with hardware security, cryptographic design, or other specialized domains.
• Expertise with advanced packaging technologies (e.g., 3D stacking, chiplet designs).
• Knowledge of system-level architecture and its impact on chip design and performance.
• Experience with multiple silicon tape-outs and leading teams through production ramp-up.

What We Offer:

• Competitive salary and comprehensive benefits package.
• Opportunity to work on groundbreaking semiconductor technologies with a leading industry player.
• A collaborative, fast-paced, and innovative work environment.
• Significant career growth and development opportunities in a rapidly expanding company.

How to Apply:

Interested candidates should submit their resume and portfolio (if applicable) to hiring@aisemicon.in . Please reference the position title "Silicon Chip Lead" in the subject line.